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• Qualified for Automotive Applications |
• AECA-Q100 Qualified with the following results:
– Device temperature grade –40°C to +140°C
– Device HBM classification level 2
– Device CDM classification level C6 |
• 5-V Turn-off Under Voltage Lockout (UVLO) |
• Drives Two N-Channel MOSFETs in High-Sideand Low-Side Configuration With IndependentInputs |
• Maximum Boot Voltage 120-V DC |
• 4-A Sink, 4-A Source Output Currents |
• 0.9-Ω Pullup and Pulldown Resistance |
• Input Pins Can Tolerate –10 V to +20 V and are
Independent of Supply Voltage Range
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• TTL Compatible Inputs |
• 5-V to 17-V VDD Operating Range, (20-V ABS
Maximum) |
• 7.2-ns Rise and 5.5-ns Fall Time With 1000-pF
Load |
• Fast Propagation Delay Times (20-ns typical)
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• 4-ns Typical Delay Matching |
• Available in the SOIC8(Powerpad) package |
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CATALOG |
UCC27212AQDDARQ1 COUNTRY OF ORIGIN |
UCC27212AQDDARQ1 PARAMETRIC INFO |
UCC27212AQDDARQ1 PACKAGE INFO |
UCC27212AQDDARQ1 MANUFACTURING INFO |
UCC27212AQDDARQ1 PACKAGING INFO |
UCC27212AQDDARQ1 ECAD MODELS |
UCC27212AQDDARQ1 FUNCTIONAL BLOCK DIAGRAM |
UCC27212AQDDARQ1 APPLICATIONS |
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COUNTRY OF ORIGIN |
Mexico |
China |
Malaysia |
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PARAMETRIC INFO |
Driver Type |
High and Low Side |
Number of Drivers |
2 |
Bridge Type |
Full Bridge|Half Bridge |
Driver Configuration |
Inverting|Non-Inverting |
Input Logic Compatibility |
TTL |
Maximum Operating Supply Voltage (V) |
17 |
Peak Output Current (A) |
4 |
Minimum Operating Temperature (°C) |
-40 |
Type |
IGBT|MOSFET |
Maximum Operating Temperature (°C) |
140 |
Maximum Turn-Off Delay Time (ns) |
9.5 |
Maximum Turn-On Delay Time (ns) |
9.5 |
High and Low Sides Dependency |
Independent |
Number of Outputs |
2 |
Minimum Operating Supply Voltage (V) |
7 |
Typical Operating Supply Voltage (V) |
12 |
Maximum Supply Current (mA) |
6.5 |
Absolute Propagation Delay Time (ns) |
57 |
Maximum Propagation Delay Time (ns) |
57 |
Maximum Rise Time (ns) |
13(Typ) |
Maximum Fall Time (ns) |
13(Typ) |
Typical Input High Threshold Voltage (V) |
2.3 |
Typical Input Low Threshold Voltage (V) |
1.6 |
Latch-Up Proof |
No |
Special Features |
Under Voltage Lockout |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO |
Supplier Package |
HSOIC EP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.55(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.7(Max) |
Seated Plane Height (mm) |
1.7(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Family Name |
SO |
Jedec |
MS-012-BA |
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MANUFACTURING INFO |
MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
AuAg |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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APPLICATIONS |
• Power Supplies in Automotive Applications |
• Half-Bridge and Full-Bridge Converters |
• High-Voltage Synchronous-Buck Converters |
• Two-Switch Forward Converters |
• Push-Pull and Active-Clamp Forward Converters |
• Class-D Audio Amplifiers |
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