TM4C1294NCPDTI3R Texas Instruments IC MCU 32BIT 1MB FLASH 128TQFP

label:
22/08/2023 228



CATALOG
TM4C1294NCPDTI3R COUNTRY OF ORIGIN
TM4C1294NCPDTI3R PARAMETRIC INFO
TM4C1294NCPDTI3R PACKAGE INFO
TM4C1294NCPDTI3R MANUFACTURING INFO
TM4C1294NCPDTI3R PACKAGING INFO
TM4C1294NCPDTI3R ECAD MODELS


COUNTRY OF ORIGIN
Philippines


PARAMETRIC INFO
Tradename Tiva™
Data Bus Width (bit) 32
Family Name Tiva C
Device Core ARM Cortex M4F
Maximum Clock Rate (MHz) 120
Program Memory Type Flash
Program Memory Size 1MB
RAM Size 256KB
Hardware Acceleration FPU
Trace Hardware JTAG
Encryption Standard AES
DMA Channels 32
EEPROM 6KB
Direct Memory Access Yes
Floating Point Unit Yes
Bluetooth No
Wi-Fi No
Ethernet Interface Type MII/RMII
Ethernet Speed 10Mbps/100Mbps
Multiply Accumulate Yes
Input Capture Channels 12
Output Compare Channels 12
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Power On Reset No
Memory Protection Unit Yes
Temperature Sensor Yes
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Maximum CPU Frequency (MHz) 120
Number of Programmable I/Os 15
Number of Timers 8
ADC Channels 20
ADC Resolution (bit) 12/12
Core Architecture ARM
Number of ADCs Single
PWM 4
Watchdog 2
Analog Comparators 3
Parallel Master Port No
Real Time Clock Yes
Special Features CAN Controller
Interface Type CAN/Ethernet/I2C/UART/USB
Programmability Yes
SPI 0
I2C 10
I2S 0
UART 8
USART 0
CAN 2
USB 1
Ethernet 1
Minimum Operating Supply Voltage (V) 2.97
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.63
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Operating Supply Voltage (V) 3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package TQFP
Basic Package Type Lead-Frame SMT
Pin Count 128
Lead Shape Gull-wing
PCB 128
Tab N/R
Pin Pitch (mm) 0.4
Package Length (mm) 14.05(Max)
Package Width (mm) 14.05(Max)
Package Height (mm) 1.05(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 16.1(Max)
Package Overall Width (mm) 16.1(Max)
Package Overall Height (mm) 1.2(Max)
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Quad Flat Package
Package Family Name QFP
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 1000
Packaging Document Link to Datasheet


ECAD MODELS

Producto RFQ