PIC18F46K22T-I/PT Microchip Technology 28/40/44-Pin, Low-Power, High-Performance Microcontrollers with XLP Technology

label:
20/11/2023 34



CATALOG
PIC18F46K22T-I/PT COUNTRY OF ORIGIN
PIC18F46K22T-I/PT PARAMETRIC INFO
PIC18F46K22T-I/PT PACKAGE INFO
PIC18F46K22T-I/PT MANUFACTURING INFO
PIC18F46K22T-I/PT PACKAGING INFO
PIC18F46K22T-I/PT ECAD MODELS


COUNTRY OF ORIGIN
Thailand
United States of America


PARAMETRIC INFO
Data Bus Width (bit) 8
Family Name PIC18
Device Core PIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 64
Program Memory Type Flash
Program Memory Size 64KB
RAM Size 3896B
Maximum Expanded Memory Size 2MB
EEPROM 1KB
Direct Memory Access No
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Internal/External Clock Type Internal/External
Touch Sensing Interface Yes
Power On Reset Yes
Memory Protection Unit No
Temperature Sensor No
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Maximum CPU Frequency (MHz) 64
Number of Programmable I/Os 36
Number of Timers 7
ADC Channels 30
ADC Resolution (bit) 10
Core Architecture PIC
Number of ADCs Single
PWM 2
Watchdog 1
Analog Comparators 2
Parallel Master Port No
Real Time Clock No
Timers Resolution (bit) 8/8/8
Interface Type I2C/SPI/USART
Programmability Yes
SPI 2
I2C 2
Process Technology XLP
I2S 0
UART 0
USART 2
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 1000
Minimum Operating Supply Voltage (V) 2.3
Typical Operating Supply Voltage (V) 2.5|3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package TQFP
Basic Package Type Lead-Frame SMT
Pin Count 44
Lead Shape Gull-wing
PCB 44
Tab N/R
Package Length (mm) 10
Package Width (mm) 10
Package Height (mm) 1
Package Diameter (mm) N/R
Mounting Surface Mount
Package Material Plastic
Package Description Thin Quad Flat Package
Package Family Name QFP
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1|3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 1200
Reel Diameter (in) 13
Tape Pitch (mm) 16
Tape Width (mm) 24
Component Orientation Q2
Packaging Document Link to Datasheet
Tape Type Embossed


ECAD MODELS

Producto RFQ